Google Tensor G5 Leak Reveals Major Upgrades: TSMC 3nm Node, Custom ISP, and More
The upcoming Google Tensor G5 chipset, expected to power the Pixel 10 series, is making waves in the tech world as new leaks reveal significant upgrades over its predecessors. According to a detailed report from Android Authority, the Tensor G5 will mark a major shift in Google’s chipset strategy, with key changes in design, fabrication, and components.

TSMC Takes Over Fabrication
One of the most notable changes is the switch from Samsung to TSMC for chip fabrication. The Tensor G5 will be built on TSMC’s cutting-edge 3nm-class node, promising improved performance and energy efficiency. This move aligns Google with industry leaders like Apple, who have also relied on TSMC’s advanced manufacturing processes.
Imagination Technologies GPU Replaces Arm Mali
Another significant upgrade is the adoption of an Imagination Technologies GPU, specifically the IMG DXT, replacing the Arm Mali-G715 MP7 used in the Tensor G4. This shift could bring enhanced graphics performance, benefiting gaming, AR/VR applications, and overall visual experiences on Pixel devices.
Fully Custom ISP for Better Camera Performance
The Tensor G5 will also feature a fully custom image signal processor (ISP), a first for Google’s Tensor lineup. Previous Tensor chips used partially custom ISPs based on Samsung designs with Google modifications. The new custom ISP is expected to deliver substantial improvements in camera performance, particularly in areas like low-light photography, image processing speed, and overall image quality.
Custom Memory Controller and System-Level Cache
Google is reportedly developing a custom memory controller and system-level cache for the Tensor G5, which should optimize data handling and improve overall system performance. Additionally, custom power modules are expected to enhance energy efficiency, extending battery life on Pixel devices.
Advanced Video Codec Support
The Tensor G5 will move away from Google’s custom “BigWave” AV1 video codec and Samsung’s MFC (Multi Format Codec). Instead, it will utilize Chips&Media’s WAVE677DV, which supports encoding and decoding for AV1, VP9, HEVC, and H.264 formats. This change ensures broader compatibility and improved video processing capabilities.
Third-Party Components and Interfaces
The Tensor G5 will also incorporate third-party components for USB, PCIe, and I3C interfaces, as well as third-party solutions for display (DSI), DisplayPort, flash storage, and LPDDR5x memory. These additions highlight Google’s focus on creating a versatile and high-performance chipset.
What This Means for the Pixel 10 Series
The Tensor G5’s upgrades signal Google’s commitment to competing with other flagship chipsets, such as Apple’s A-series and Qualcomm’s Snapdragon. With improved fabrication, a custom ISP, and advanced GPU and video codec support, the Pixel 10 series is poised to deliver a premium experience in performance, photography, and efficiency.